Part Number Hot Search : 
MG31D TM400PZ P0900SD BYV96 50600 1VSN221M HIROSE 4006B
Product Description
Full Text Search
 

To Download FD075H06A5 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Bulletin PD-20992 02/02
FD075H06A5
Fred Die in Wafer Form
a c
0.35 0.01 (14 0.4)
NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS):
C b d A
3. DIMENSIONS AND TOLERANCES: a = 1.905 + 0, -0.01 (75 + 0, -04) b = 1.905 + 0, -0.01 (75 + 0, -04) c = 1.199 + 0, -0.01 (47.2 + 0, -04) d = 1.199 + 0, -0.01 (47.2 + 0, -04) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, -0.005 (2 + 0, - 0.2)
40 (1.57)
Wafer flat alligned with side b of the die
O 125 (4.92)
NOT TO SCALE
www.irf.com
1
FD075H06A5
Bulletin PD-20992 02/02
Electrical Characteristics (Wafer Form)
Parameters
VFM VRRM IRM trr Typical Forward Voltage Mimunum Reverse Breakdown Voltage Max. Reverse Leakage Current Typ. Reverse Recovery Time
Units
1.5 V 600 V 50A 27 ns
Test Conditions
TJ = 25C, I F = 3 A T J = 25C, I RRM = 100 A T J = 25C, V RRM = 600 V I F = 1A, di/ dt = 100A/s, V R = 30 V
Mechanical Data
Nominal Back Metal Composition, Thickness Nominal Front Metal Composition, Thickness Chip Dimensions Reject Ink Dot Size Recommended Storage Environment Cr - Ni - Ag (1 KA - 2 KA - 3 KA) 99% Al, 1% Si (3 microns) 0.160" x 0.160" (see drawing) 0.25 mm diameter minimum Storage in original container, in dessicated nitrogen, with no contamination
Packaging
Device #
FD075xxxx5B FD075xxxx5R FD075xxxx5P FD075xxxx5F
Description
Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film
Minimum Order Quantity Die in Sale Package
2500 n/a 2500 2500
2
www.irf.com
FD075H06A5
Bulletin PD-20992 02/02
Ordering Information Table
Device Code
FD
1
075
2
H
3
06
4
A
5
5
6
B
7
1 2 3 4 5 6 7
-
Fred Die Chip Dimension in Mils: Process: Voltage code Vrrm (*100) eg: Chip surface metallization: Wafer diameter in inches Packaging (B = inked Probed Unsawn Wafers) 075 = 75 x 75 square H 06 A = HyperFast = 600V = Aluminium (anode), Silver (cathode)
Data and specifications subject to change without notice. This product has been designed and qualified for Industrial Level. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7309 Visit us at www.irf.com for sales contact information. 02/02
www.irf.com
3


▲Up To Search▲   

 
Price & Availability of FD075H06A5

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X